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| MBRS130LT3 Preferred Device Schottky Power Rectifier Surface Mount Power Package This device employs the Schottky Barrier principle in a large area metal-to-silicon power diode. State-of-the-art geometry features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency rectification, or as free wheeling and polarity protection diodes, in surface mount applications where compact size and weight are critical to the system. Features http://onsemi.com * * * * * SCHOTTKY BARRIER RECTIFIER 1.0 AMPERE 30 VOLTS Very Low Forward Voltage Drop (0.395 Volts Max @ 1.0 A, TJ = 25C) Small Compact Surface Mountable Package with J-Bend Leads Highly Stable Oxide Passivated Junction Guard-Ring for Stress Protection Pb-Free Package is Available SMB CASE 403A PLASTIC Mechanical Characteristics * Case: Epoxy, Molded * Weight: 95 mg (approximately) * Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable MARKING DIAGRAM AYWW 1BL3G G * Lead and Mounting Surface Temperature for Soldering Purposes: * 260C Max. for 10 Seconds Cathode Polarity Band 1BL3 = Specific Device Code A = Assembly Location Y = Year WW = Work Week G = Pb-Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Device MBRS130LT3 MBRS130LT3G Package SMB SMB (Pb-Free) Shipping 2500/Tape & Reel 2500/Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Preferred devices are recommended choices for future use and best overall value. (c) Semiconductor Components Industries, LLC, 2006 1 November, 2006 - Rev. 7 Publication Order Number: MBRS130LT3/D MBRS130LT3 MAXIMUM RATINGS Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current TL = 120C TL = 110C Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) Operating Junction Temperature Symbol VRRM VRWM VR IF(AV) 1.0 2.0 IFSM TJ 40 -65 to +125 A C Value 30 Unit V A THERMAL CHARACTERISTICS Rating Thermal Resistance, Junction-to-Lead Thermal Resistance, Junction-to-Ambient (TA = 25C, Min Pad, 1 oz copper) Junction-to-Ambient (TA = 25C, 1" Pad, 1 oz copper) Symbol YJL 12 RqJA 228.8 71.3 C/W Value Unit C/W Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. ELECTRICAL CHARACTERISTICS Characteristic Maximum Instantaneous Forward Voltage (Note 1) (iF = 1.0 A, TJ = 25C) (iF = 2.0 A, TJ = 25C) Maximum Instantaneous Reverse Current (Note 1) (Rated dc Voltage, TJ = 25C) (Rated dc Voltage, TJ = 100C) 1. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2%. Symbol VF 0.395 0.445 IR 1.0 10 mA Value Unit V http://onsemi.com 2 MBRS130LT3 IF, INSTANTANEOUS FORWARD CURRENT (A) IF, MAXIMUM INSTANTANEOUS FORWARD CURRENT (A) 10 10 TJ = 100C 1 25C 1 TJ = 100C 25C 0.1 0.0 0.1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 VF, MAXIMUM INSTANTANEOUS VOLTAGE (V) 0.1 0.2 0.3 0.4 0.5 0.6 0.7 VF, INSTANTANEOUS VOLTAGE (V) Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage IR, IREVERSE CURRENT (mA) 100 10 1.0 0.1 0.01 0.001 TJ = 100C 25C IR, IREVERSE CURRENT (mA) 100 10 1.0 0.1 0.01 0.001 TJ = 100C 25C 0 3 6 9 12 15 18 21 24 27 30 0 3 6 9 12 15 18 21 24 27 30 VR, REVERSE VOLTAGE (V) VR, REVERSE VOLTAGE (V) Figure 3. Typical Reverse Leakage Current Figure 4. Typical Maximum Reverse Leakage Curent 1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 100 105 110 115 120 125 130 SQUARE WAVE DC PF(AV), AVERAGE POWER DISSIPATION (W) IF(AV), AVERAGE FORWARD CURRENT (A) 2 0.9 0.8 0.7 0.6 0.5 SQUARE 0.4 0.3 0.2 0.1 0 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 IF(AV), AVERAGE FORWARD CURRENT (A) DC TC, CASE TEMPERATURE (C) Figure 5. Current Derating (Case) Figure 6. Typical Power Dissipation http://onsemi.com 3 MBRS130LT3 400 350 C, CAPACITANCE (pF) 300 250 200 150 100 50 0 0 4 8 12 16 20 24 28 32 NOTE: TYPICAL CAPACITANCE AT 0 V = 290 pF VR, REVERSE VOLTAGE (VOLTS) Figure 7. Typical Capacitance EFFECTIVE TRANSIENT THERMAL RESISTANCE 1000 D = 0.5 100 0.2 0.1 0.05 10 0.02 0.01 1 SINGLE PULSE 0.1 0.000001 0.00001 0.0001 0.001 0.01 t, TIME (s) 0.1 1 10 100 1000 Figure 8. Thermal Response, Min Pad EFFECTIVE TRANSIENT THERMAL RESISTANCE 100 D = 0.5 0.2 10 0.1 0.05 0.02 1 0.01 SINGLE PULSE 0.1 0.000001 0.00001 0.0001 0.001 0.01 t, TIME (s) 0.1 1 10 100 1000 Figure 9. Thermal Response, 1 Inch Pad http://onsemi.com 4 MBRS130LT3 275 250 200 qJA (C/W) 175 150 125 100 75 50 25 0 0 100 200 300 400 500 600 700 COPPER AREA (mm2) 1.0 oz 2.0 oz POWER DISSIPATION (W) 225 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 0 100 200 300 400 500 600 700 COPPER AREA (mm2) Power based on TA = 25C 2.0 oz 1.0 oz Figure 10. Thermal Resistance vs. Copper Area Figure 11. Power Dissipation vs. Copper Area http://onsemi.com 5 MBRS130LT3 PACKAGE DIMENSIONS SMB PLASTIC PACKAGE CASE 403A-03 ISSUE F HE E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P. DIM A A1 b c D E HE L L1 MIN 1.90 0.05 1.96 0.15 3.30 4.06 5.21 0.76 MILLIMETERS NOM MAX 2.13 2.45 0.10 0.20 2.03 2.20 0.23 0.31 3.56 3.95 4.32 4.60 5.44 5.60 1.02 1.60 0.51 REF MIN 0.075 0.002 0.077 0.006 0.130 0.160 0.205 0.030 INCHES NOM 0.084 0.004 0.080 0.009 0.140 0.170 0.214 0.040 0.020 REF MAX 0.096 0.008 0.087 0.012 0.156 0.181 0.220 0.063 b D A L L1 c A1 SOLDERING FOOTPRINT* 2.261 0.089 2.743 0.108 2.159 0.085 SCALE 8:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative http://onsemi.com 6 MBRS130LT3/D |
Price & Availability of MBRS130LT307
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